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NCP583 Ultra-Low Iq 150 mA CMOS LDO Regulator with Enable
The NCP583 series of low dropout regulators are designed for portable battery powered applications which require precise output voltage accuracy and low quiescent current. These devices feature an enable function which lowers current consumption significantly and are offered in two small packages; SC-82AB and the SOT-563. A 1.0 mF ceramic capacitor is the recommended value to be used with these devices on the output pin.
Features http://onsemi.com MARKING DIAGRAMS
SC-82AB SQ SUFFIX CASE 419C 1 1
* * * * * * * * * * *
Ultra-Low Dropout Voltage of 250 mV at 150 mA Excellent Line Regulation of 0.05%/V Excellent Load Regulation of 20 mV High Output Voltage Accuracy of "2% Ultra-Low Iq Current of 1.0 mA Very Low Shutdown Current of 0.1 mA Wide Output Voltage Range of 1.5 V to 3.3 V Low Temperature Drift Coefficient on the Output Voltage of "100 ppm/C Fold Back Protection Circuit Input Voltage up to 6.5 V These are Pb-Free Devices
4
xxx M G G
M
6 1
SOT-563 XV SUFFIX CASE 463A 1
xxx M G G
Typical Applications
xxx = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.
* Portable Equipment * Hand-Held Instrumentation * Camcorders and Cameras
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
Vin
Vout
- + Vref Current Limit CE GND
Figure 1. Simplified Block Diagram
(c) Semiconductor Components Industries, LLC, 2007
1
February, 2007 - Rev. 8
Publication Order Number: NCP583/D
NCP583
PIN FUNCTION DESCRIPTION
SOT-563 Pin 1 2 3 4 5 6 SC-82AB Pin 4 2 3 - - 1 Symbol Vin GND Vout NC GND CE Power supply input voltage. Power supply ground. Regulated output voltage. No connect. Power supply ground. Chip enable pin. Description
MAXIMUM RATINGS
Rating Input Voltage Input Voltage (CE or CE Pin) Output Voltage Output Current Thermal Junction Resistance SC-82AB SOT-563 Operating Ambient Temperature Range Operating Junction Temperature Range Storage Temperature Range Symbol Vin VCE Vout Iout RqJA 263 200 TA TJ Tstg -40 to +85 -40 to +125 -55 to +150 C C C Value 6.5 6.5 -0.3 to Vin +0.3 180 Unit V V V mA C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.0 V, TA = -40C to +85C, unless otherwise noted.)
Characteristic Input Voltage Output Voltage (1.0 mA Iout 30 mA) Line Regulation (Iout = 30 mA) (Vout + 0.5 V v Vin v 6.0 V) Load Regulation (1.0 mA Iout 150 mA) Dropout Voltage (Iout = 150 mA) Vout = 1.5 V Vout = 1.8 V Vout = 2.5 V 2.8 V v Vout v 3.3 V Quiescent Current (Iout = 0 mA) Output Current Shutdown Current (VCE = Gnd) Output Short Circuit Current (Vout = 0) Enable Input Threshold Voltage High Low Output Voltage Temperature Coefficient (Iout = 30 mA, -40C TA 85C) Symbol Vin Vout Regline Regload VDO - - - - Iq Iout ISD Ilim Vthenh Vthenl DVout/DT - 150 - - 1.2 0 - 0.60 0.50 0.35 0.25 1.0 - 0.1 40 - - 100 0.90 0.75 0.55 0.40 1.5 - 1.0 - 6.0 0.3 - ppm/C mA mA mA mA V Min 1.7 Vout x 0.96 - - Typ - - 0.05 20 Max 6.0 Vout x 1.04 0.20 40 Unit V V %/V mV V
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NCP583
TYPICAL CHARACTERISTICS
3.0 OUTPUT VOLTAGE Vout (V) OUTPUT VOLTAGE Vout (V) 2.5 2.0 1.5 1.0 0.5 Vout = 2.8 V 0 0 100 200 300 400 500 3.3 V 3.5 V Vin = 3.1 V 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 2.0 1.0 2.0 Iout = 50 mA Vout = 2.8 V 3.0 4.0 5.0 6.0 Iout = 1.0 mA Iout = 30 mA
OUTPUT CURRENT Iout (mA)
INPUT VOLTAGE Vin (V)
Figure 2. Output Voltage vs. Output Current
Figure 3. Output Voltage vs. Input Voltage
1.2 QUIESCENT CURRENT, Iq (mA) OUTPUT VOLTAGE, Vout (V) Vout = 2.8 V 0.0 0 1.0 2.0 3.0 4.0 5.0 6.0 1.0 0.8 0.6 0.4 0.2
2.86 2.84 2.82 2.80 2.78 2.76 Vout = 2.8 V 2.74 -40 -15 10 35 60 85
INPUT VOLTAGE Vin (V)
TEMPERATURE (C)
Figure 4. Quiescent Current vs. Input Voltage
1.4 QUIESCENT CURRENT, Iq (mA) 1.2 1.0 0.8 0.6 0.4 0.2 Vout = 1.5 V 0.0 -40 -15 10 35 60 85 QUIESCENT CURRENT, Iq (mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2
Figure 5. Output Voltage vs. Temperature
Vout = 2.8 V 0.0 -40 -15 10 35 60 85
TEMPERATURE (C)
TEMPERATURE (C)
Figure 6. Quiescent Current vs. Temperature
Figure 7. Quiescent Current vs. Temperature
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NCP583
TYPICAL CHARACTERISTICS
1.0 DROPOUT VOLTAGE, VDO (V) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 -40C 25C Vout = 1.5 V 85C 0.40 DROPOUT VOLTAGE, VDO (V) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Vout = 1.8 V 0.00 0 25 50 75 100 125 150 -40C 25C 85C
OUTPUT CURRENT Iout (mA)
OUTPUT CURRENT Iout (mA)
Figure 8. Dropout Voltage vs. Output Current
Figure 9. Dropout Voltage vs. Output Current
0.40 DROPOUT VOLTAGE, VDO (V) RIPPLE REJECTION, RR (dB) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Vout = 2.8 V 0.00 0 25 50 75 100 125 150 -40C 25C 85C
70 60 50 40 30 20 10 0 0.1 Iout = 1.0 mA Iout = 30 mA Iout = 50 mA 1 10 100 Vout = 2.8 V Vin = 3.8 V + 0.5 Vp-p Cout = 0.1 mF
OUTPUT CURRENT Iout (mA)
FREQUENCY, f (kHz)
Figure 10. Dropout Voltage vs. Output Current
Figure 11. Ripple Rejection vs. Frequency
70 RIPPLE REJECTION, RR (dB) 60 50 40 30 Iout = 1.0 mA 20 10 0 0.1
Vout = 2.8 V Vin = 3.8 V + 0.5 Vp-p Cout = 1.0 mF
Iout = 30 mA Iout = 50 mA 1 10 100
FREQUENCY, f (kHz)
Figure 12. Ripple Rejection vs. Frequency
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NCP583
TYPICAL CHARACTERISTICS
5.5 OUTPUT VOLTAGE, Vout (V) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 0 20 40 60 80 100 120 140 160 180 TIME, T (ms) Output Voltage Input Voltage
Cout = 0.1 mF
6 5 4 3 2 1 0 -1 200 INPUT VOLTAGE, Vin (V) INPUT VOLTAGE, Vin (V) INPUT VOLTAGE, Vin (V)
Cout = 0.47 mF
5.5 OUTPUT VOLTAGE, Vout (V) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 0 20 40 60 80 100 120 140 160 180 TIME, T (ms) Output Voltage Input Voltage 6 5 4 3 2 1 0 -1 200
Cout = 1.0 mF
5.5 OUTPUT VOLTAGE, Vout (V) 5.0 Input Voltage 4.5 4.0 3.5 3.0 2.5 2.0 0 20 40 60 80 100 120 140 160 180 TIME, T (ms) Output Voltage 4 3 2 1 0 -1 200 6 5
Figure 13. Input Transient Response (Vout = 2.8 V, Iout = 30 mA, tr = tf = 5.0 ms, Cin = 0)
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NCP583
TYPICAL CHARACTERISTICS
Cout = 1.0 mF
5.0 OUTPUT VOLTAGE, Vout (V) 4.5 Output Current 4.0 3.5 3.0 2.5 2.0 0 100 200 300 400 500 600 700 800 900 1000 TIME, T (ms) Output Voltage 0 -10 20 10 OUTPUT CURRENT, Iout (mA) OUTPUT CURRENT, Iout (mA)
Cout = 10 mF
5.0 OUTPUT VOLTAGE, Vout (V) 4.5 Output Current 4.0 3.5 3.0 2.5 2.0 0 100 200 300 400 500 600 700 800 900 1000 TIME, T (ms) Output Voltage 0 -10 20 10
Figure 14. Load Transient Response (Vout = 2.8 V, tr = tf = 5.0 ms, Vin = 3.8 V)
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NCP583
TYPICAL CHARACTERISTICS
Cout = 0.1 mF
5.0 OUTPUT VOLTAGE, Vout (V) 4.5 Output Current 4.0 3.5 3.0 2.5 2.0 0 20 40 60 80 100 120 140 160 180 200 TIME, T (ms) Output Voltage 50 0 150 100 OUTPUT CURRENT, Iout (mA) OUTPUT CURRENT, Iout (mA) OUTPUT CURRENT, Iout (mA)
Cout = 0.47 mF
5.0 OUTPUT VOLTAGE, Vout (V) 4.5 Output Current 4.0 3.5 3.0 2.5 2.0 0 20 40 60 80 100 120 140 160 180 200 TIME, T (ms) Output Voltage 50 0 150 100
Cout = 1.0 mF
5.0 OUTPUT VOLTAGE, Vout (V) 4.5 Output Current 4.0 3.5 3.0 2.5 2.0 0 20 40 60 80 100 120 140 160 180 200 TIME, T (ms) Output Voltage 50 0 150 100
Figure 15. Load Transient Response (Vout = 2.8 V, tr = tf = 5.0 ms, Vin = 3.8 V)
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NCP583
APPLICATION INFORMATION
Input Decoupling Output Decoupling
A 1.0 mF ceramic capacitor is the recommended value to be connected between Vin and GND. For PCB layout considerations, the traces of Vin and GND should be sufficiently wide in order to minimize noise and prevent unstable operation.
It is recommended to use a 0.1 mF ceramic capacitor on the Vout pin. For better performance, select a capacitor with low Equivalent Series Resistance (ESR). For PCB layout considerations, place the output capacitor close to the output pin and keep the leads short as possible.
ORDERING INFORMATION
Output Type / Features Device NCP583SQ15T1G NCP583SQ18T1G NCP583SQ25T1G NCP583SQ28T1G NCP583SQ30T1G NCP583SQ33T1G NCP583XV15T2G NCP583XV18T2G NCP583XV25T2G NCP583XV28T2G NCP583XV29T2G NCP583XV30T2G NCP583XV31T2G NCP583XV33T2G Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Active High w/Enable Nominal Output Voltage 1.5 1.8 2.5 2.8 3.0 3.3 1.5 1.8 2.5 2.8 2.9 3.0 3.1 3.3 Marking A5 A8 B5 B8 C0 C3 G15B G18B G25B G28B G29B G30B G31B G33B Package SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SC-82AB (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) SOT-563 (Pb-Free) Shipping 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel 4000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Other voltages are available. Consult your ON Semiconductor representative.
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NCP583
PACKAGE DIMENSIONS
SOT-563 XV SUFFIX CASE 463A-01 ISSUE F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 0.50 0.55 0.60 0.17 0.22 0.27 0.08 0.12 0.18 1.50 1.60 1.70 1.10 1.20 1.30 0.5 BSC 0.10 0.20 0.30 1.50 1.60 1.70 INCHES NOM MAX 0.021 0.023 0.009 0.011 0.005 0.007 0.062 0.066 0.047 0.051 0.02 BSC 0.004 0.008 0.012 0.059 0.062 0.066 MIN 0.020 0.007 0.003 0.059 0.043
D -X-
A L
4
6
5
1
2
3
E -Y-
HE
b e
5 6 PL M
C XY
0.08 (0.003)
DIM A b C D E e L HE
SOLDERING FOOTPRINT*
0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394
0.5 0.5 0.0197 0.0197
SCALE 20:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP583
PACKAGE DIMENSIONS
SC-82AB SQ SUFFIX CASE 419C-02 ISSUE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 419C-01 OBSOLETE. NEW STANDARD IS 419C-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A B C D F G H J K L N S MILLIMETERS MIN MAX 1.8 2.2 1.15 1.35 0.8 1.1 0.2 0.4 0.3 0.5 1.1 1.5 0.0 0.1 0.10 0.26 0.1 --- 0.05 BSC 0.2 REF 1.8 2.4 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 --- 0.002 BSC 0.008 REF 0.07 0.09
A G D 3 PL
4 3
C N
S
1 2
B
K
F L
H J 0.05 (0.002)
SOLDERING FOOTPRINT*
1.30 0.512 0.65 0.026
0.90 0.035 0.70 0.028
1.90 0.95 0.075 0.037
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NCP583/D

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